HBM lithography bonding (hybrid bonding)
Copper hybrid bonding enabling HBM4 stacking
Hybrid (copper-to-copper) bonding is the die-stacking technique that HBM4 and advanced logic-on-logic increasingly require as micro-bump pitch hits its limit. Tool control sits with Applied Materials, BESI and EV Group, making bonding-tool capacity a real 2025-2026 bottleneck for both HBM and SoIC-class packaging.
Tool leaders
BESI, EV Group, Applied Materials
Enables
HBM4, logic-on-logic
How it fits the stack
HBM lithography bonding (hybrid bonding) with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
HBM lithography bonding (hybrid bonding) in the AI stack. HBM lithography bonding (hybrid bonding) with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 4 entities, 3 relationships
- HBM lithography bonding (hybrid bonding) —depends on→ BE Semiconductor (Besi)
- HBM lithography bonding (hybrid bonding) —depends on→ EV Group
- HBM4 —depends on→ HBM lithography bonding (hybrid bonding)
Depends on ↑ · 2