Resonac (CMP slurry & packaging materials)
Leading CMP slurry + advanced packaging materials
Resonac (formerly Showa Denko / Hitachi Chemical) is a leading supplier of CMP slurries, die-attach films, and advanced-packaging materials, and co-leads a global 2.xD/3D packaging materials consortium (JOINT2). CMP slurry is a consumable chokepoint tightly coupled to every planarization step; Resonac plus Fujimi and Cabot dominate it. Its packaging-material portfolio makes it a hidden enabler of chiplet/HBM integration.
Products
CMP slurry, die-attach film
Consortium
JOINT2 packaging
How it fits the stack
Resonac (CMP slurry & packaging materials) with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
Resonac (CMP slurry & packaging materials) in the AI stack. Resonac (CMP slurry & packaging materials) with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 3 entities, 2 relationships
- TSMC (Taiwan Semiconductor Manufacturing Company) —supplies→ Resonac (CMP slurry & packaging materials)
- TSMC CoWoS (Chip-on-Wafer-on-Substrate) —supplies→ Resonac (CMP slurry & packaging materials)