Tongfu Microelectronics
AMD's key China OSAT partner
Tongfu Microelectronics is a major Chinese OSAT and AMD's primary packaging/test partner (via a JV), increasingly building indigenous 2.5D/chiplet advanced-packaging lines. It anchors China's push to localize the back-end of AI-chip production amid tightening US controls.
Key partner
AMD JV
Focus
Chiplet/2.5D packaging
How it fits the stack
Tongfu Microelectronics with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
Tongfu Microelectronics in the AI stack. Tongfu Microelectronics with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 2 entities, 1 relationships
- Tongfu Microelectronics —partners with→ AMD
Context — capital, rivals, policy · · 1