Advanced packaging capacity (US/Japan)
Onshore CoWoS/advanced-packaging gap
Even as TSMC Arizona ramps front-end wafers, advanced packaging (CoWoS/SoIC) capacity remains overwhelmingly in Taiwan; Amkor's Arizona OSAT and TSMC's planned US packaging are early-stage. This front-end/back-end geographic mismatch means US-made wafers still fly to Taiwan to be packaged, undercutting resilience claims.
Gap
US wafers, Taiwan packaging
US OSAT
Amkor Arizona (early)
How it fits the stack
Advanced packaging capacity (US/Japan) with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
Advanced packaging capacity (US/Japan) in the AI stack. Advanced packaging capacity (US/Japan) with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 2 entities, 1 relationships
- Advanced packaging capacity (US/Japan) —depends on→ Amkor Technology