Amkor Technology
Largest US-HQ OSAT, key to US onshored packaging
Amkor is the largest US-headquartered outsourced semiconductor assembly and test (OSAT) provider and the world's number-two OSAT overall. It is central to onshoring advanced packaging: it is building a $2B+ advanced-packaging and test campus in Peoria, Arizona, adjacent to TSMC's fabs, and partners with TSMC and Apple to complete a US end-to-end flow. It provides 2.5D/3D and fan-out packaging that complements TSMC's in-house CoWoS as AI packaging demand outstrips capacity.
Rank
#2 OSAT globally, #1 US-HQ
Arizona campus
$2B+ Peoria advanced packaging near TSMC
Offerings
2.5D/3D, fan-out (FOWLP), test
How it fits the stack
Amkor Technology with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
Amkor Technology in the AI stack. Amkor Technology with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 5 entities, 4 relationships
- Amkor Technology —supplies→ Lead-frame & bonding-wire supply (Chang Wah)
- Advanced packaging capacity (US/Japan) —depends on→ Amkor Technology
- US Advanced-Packaging Gap —depends on→ Amkor Technology
- Amkor Technology —partners with→ TSMC (Taiwan Semiconductor Manufacturing Company)
Context — capital, rivals, policy · · 1