US Advanced-Packaging Gap
US lacks domestic CoWoS-scale packaging
Even as TSMC Arizona ramps front-end wafers, the US has almost no domestic CoWoS-class advanced-packaging capacity, so Arizona-made wafers must ship back to Taiwan for packaging. Amkor's Peoria AZ plant and TSMC's planned AZ packaging aim to close this, but through 2026 the back-end remains a US supply-chain hole.
Gap
No US CoWoS at scale
Fix underway
Amkor Peoria, TSMC AZ
How it fits the stack
US Advanced-Packaging Gap with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
US Advanced-Packaging Gap in the AI stack. US Advanced-Packaging Gap with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 3 entities, 2 relationships
- US Advanced-Packaging Gap —depends on→ Amkor Technology
- TSMC Arizona (Fab 21) —depends on→ US Advanced-Packaging Gap
Depends on ↑ · 1