JCET (advanced packaging)
China's largest OSAT, building domestic CoWoS-class packaging
JCET is China's largest outsourced semiconductor assembly and test (OSAT) firm, developing 2.5D/3D advanced packaging (XDFOI) as a domestic answer to TSMC CoWoS to co-package Ascend/Cambricon logic with HBM. Advanced packaging capacity is a key bottleneck for scaling Chinese AI accelerators.
Tech
XDFOI 2.5D/3D
How it fits the stack
JCET (advanced packaging) with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
JCET (advanced packaging) in the AI stack. JCET (advanced packaging) with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 5 entities, 4 relationships
- Cambricon —uses→ JCET (advanced packaging)
- Huawei Ascend (910B/910C) —uses→ JCET (advanced packaging)
- JCET (advanced packaging) —partners with→ SMIC (Semiconductor Manufacturing International Corp)
- JCET (advanced packaging) —competes with→ TSMC CoWoS (Chip-on-Wafer-on-Substrate)