TSMC 3DFabric / InFO
TSMC's advanced-packaging platform family
3DFabric is TSMC's umbrella for its advanced-packaging technologies — CoWoS, SoIC and InFO (Integrated Fan-Out) — that stack and interconnect logic, HBM and chiplets. InFO powers mobile SoCs while CoWoS/SoIC power AI accelerators; the platform is the packaging moat NVIDIA and AMD are locked into.
Members
CoWoS, SoIC, InFO
Role
Chiplet/HBM integration moat
How it fits the stack
TSMC 3DFabric / InFO with what it depends on (above) and what it feeds (below). The figure renders as a crawlable diagram and upgrades to an interactive 3D graph as it scrolls into view.
TSMC 3DFabric / InFO in the AI stack. TSMC 3DFabric / InFO with its immediate upstream dependencies (top) and downstream dependents (bottom) in the AI value chain. Hover a node in 3D, or read the full relationships below.
Graph data (text) — 4 entities, 3 relationships
- TSMC 3DFabric / InFO —uses→ TSMC CoWoS (Chip-on-Wafer-on-Substrate)
- TSMC 3DFabric / InFO —uses→ TSMC SoIC (System-on-Integrated-Chips)
- TSMC 3DFabric / InFO —partners with→ UCIe (chiplet interconnect)
Context — capital, rivals, policy · · 1