AI Notebook · Intelligence graph
The AI Intelligence Graph
Every company, chip, mineral, power source, fund and policy in the AI economy, linked by how they depend on, fund, supply and compete with each other. Pick any entity, layer or category: the graph flies there and the file below follows, from the whole stack down to one company's deals and filings.
- entities
- 455
- entities
- typed links
- 1,171
- typed links
- deals quoted from filings
- 16
- deals quoted from filings
- company files
- 3
- company files
Layers as clusters, money as arcs, brand marks on the biggest stars
AI Intelligence Graph
Starting the view
Follows the graph · 455 entities
Ask the graph
answers only from the graph's sourced facts, with citationsForecast record
No forecast published here yet. Each one names its basis and the date it resolves, is scored afterwards, and the hit rate shows here in public once the first resolves.
- Entities
- 455
- Links
- 1,171
- Deals from filings
- 16
- Chokepoints
- 121
- Public companies
- 137
- Company files
- 3
- Depends on outside
- 0
- supply links in
- Supplies outside
- 0
- supply links out
The stack by layer
7 rows · click to drill in| Layer | Entities | Links | Deals | Choke | Needs | Feeds |
|---|---|---|---|---|---|---|
| 123 | 394 | 16 | 10 | 98 | 30 | |
| 32 | 174 | 5 | 2 | 91 | 42 | |
| 54 | 322 | 4 | 11 | 97 | 107 | |
| 30 | 199 | · | 13 | 90 | 51 | |
| 45 | 185 | · | 21 | 16 | 85 | |
| 39 | 90 | · | 26 | 1 | 62 | |
| 132 | 448 | 7 | 38 | 70 | 86 |
Most connected
linksChokepoints
entities that depend on itHow the stack leans on itself
supply links · row depends on column| Depends on → | L0 Labs | L1 Cloud | L2 Chips | L3 Fabs | L4 Tools | L5 Materials | L6 Power |
|---|---|---|---|---|---|---|---|
| 123 | 36 | 41 | 1 | · | · | 20 | |
| 11 | 8 | 38 | 1 | · | · | 41 | |
| 3 | 3 | 27 | 40 | 30 | 7 | 14 | |
| · | · | 1 | 15 | 51 | 29 | 9 | |
| · | · | · | 2 | 44 | 12 | 2 | |
| · | · | · | · | 1 | 17 | · | |
| 16 | 3 | 27 | 7 | 3 | 14 | 80 |
Links come from the AI Systems Map ontology. Deals carry the filing's own wording and a quote, checked against the document; latest source 2026-10-26. Not investment advice.
Every entity in the graph, by layer
Frontier labs & models
- 01.AI (Yi)
- Abridge / ambient clinical AI
- Agent frameworks (LangChain, LlamaIndex, etc.)
- Agent interop protocols (A2A / AGNTCY)
- Agent Orchestration Frameworks
- Agentic AI / autonomous workflows
- AI coding agents & IDEs
- AI Coding Assistants (Cursor, Copilot, Windsurf, Claude Code)
- AI Copyright Litigation (NYT et al.)
- AI Observability & Evaluation
- AI Safety & Interpretability Research (ARC, Redwood, Apollo)
- AI Safety, Guardrails & Red-Teaming
- AI security & guardrails
- AI Talent Market / Researcher Comp
- AI-native consumer hardware
- AI21 Labs
- Aleph Alpha
- Alibaba Qwen (Tongyi)
- Alignment Methods (RLHF, Constitutional AI, DPO)
- Amazon AGI (Nova)
- Anduril / Defense AI
- Anthropic
- Anthropic capital stack (Amazon/Google)
- Apple Intelligence / On-Device AI
- Baidu ERNIE
- Baidu PaddlePaddle
- Black Forest Labs
- Bloomberg / financial-data AI
- ByteDance Doubao / Seed
- ChatGPT (Consumer Distribution)
- Claude (Opus / Sonnet)
- Cognition (Devin)
- Cohere
- Common Crawl
- Content & IP Licensing Deals
- Content Licensing & Copyright Regime
- Curated Pretraining Corpora (FineWeb, DCLM, The Stack, RedPajama)
- Cursor (Anysphere)
- DeepSeek
- DeepSeek R2 / V3.x
- DeepSeek-V3 / R1
- DeepSpeed / Megatron
- Defense & government AI
- ElevenLabs (voice AI)
- Enterprise & Vertical AI (Palantir, Glean, Harvey, Sierra, Abridge)
- Epoch AI
- ERNIE 4.5 / X1
- Evaluation & benchmark infrastructure
- Figure / Humanoid Robotics
- FlashAttention
- Frontier Evals (MMLU, GPQA, SWE-bench, ARC-AGI, HLE)
- Frontier evals & benchmarks
- Frontier Safety Frameworks (RSP / Preparedness / FSF)
- Gemini
- GitHub Copilot
- Glean
- GLM-4.6
- Google DeepMind
- GPT-5 / o-series
- Grok
- Harvey AI
- Huawei MindSpore
- Hugging Face
- Humanoid / physical AI (Figure, Tesla Optimus)
- iFlytek Spark
- JAX
- JAX / XLA
- JPMorgan (LLM Suite / financial AI)
- Kimi K2
- LangChain / LangGraph
- Licensed & proprietary data deals
- Llama
- LMArena (Chatbot Arena)
- Mercor
- Meta (Meta AI / FAIR)
- METR
- Microsoft AI (MAI)
- Midjourney / image-video gen
- MiniMax
- Mistral AI
- Mistral Large
- MLOps / experiment & observability
- MLPerf (MLCommons)
- Model Context Protocol (MCP)
- Moonshot AI (Kimi)
- Nvidia Research
- NYT v. OpenAI/Microsoft (copyright)
- OpenAI
- OpenAI PBC restructuring
- OpenEvidence
- Palantir AIP
- Perplexity AI
- Preferred Networks (PFN)
- PyTorch
- PyTorch Foundation (Linux Foundation)
- Qwen
- Reddit / content licensing deals
- Reka AI
- Reverse-acquihire / talent deals
- Robotics & physical AI (VLA models)
- Safe Superintelligence (SSI)
- Sakana AI
- Scale AI
- SGLang
- Sierra (Bret Taylor)
- StepFun (Jieyue Xingchen)
- Surge AI
- Surge AI / Mercor (expert data)
- Surge AI / Mercor / Turing (frontier data labor)
- SWE-bench / Evaluation Benchmarks
- Swiss AI Initiative (ETH/EPFL, Apertus)
- Synthetic data & distillation
- Tencent Hunyuan
- Tesla AI / xAI compute (Colossus)
- Thinking Machines Lab
- Training Data & Web Corpus
- Transformer / MoE Architecture
- UK AI Safety Institute (AISI)
- Vector databases
- Vertical & Agentic Benchmarks
- Waymo / autonomous driving
- Windsurf / GitHub Copilot / coding agents
- Zhipu AI (Z.ai / GLM)
Cloud & compute
- Alibaba Cloud (Aliyun)
- Amazon Web Services (AWS)
- ByteDance Volcano Engine
- Crusoe Energy
- Databricks
- Enterprise Data Cloud (Snowflake/Databricks)
- Fireworks AI
- Google Cloud (GCP)
- Huawei Cloud
- Inference economics / token deflation
- Inference Economics / Token Margins
- Lambda (Lambda Labs)
- llama.cpp / Ollama / GGUF (edge inference)
- Meta (AI Infrastructure)
- Microsoft Azure
- Model routers & inference marketplaces
- Model-lab compute contracts
- Nebius Group
- Nscale
- OpenRouter / Model Gateways
- Oracle Cloud Infrastructure (OCI)
- Palantir Technologies
- Salesforce Agentforce
- SAP (Joule / Business AI)
- Scaleway
- ServiceNow
- Snowflake (Cortex)
- Tencent Cloud
- Together AI
- vLLM
- vLLM / Inference Serving Stack
- Vultr
Accelerators & chips
- AMD
- Ampere Computing
- Arm Holdings
- Arm Neoverse / CSS server IP
- AWS Trainium / Inferentia
- Baidu Kunlun (Kunlunxin)
- Biren Technology
- Cambricon
- Cerebras Systems
- CUDA / software moat
- d-Matrix
- Enflame (Suiyuan)
- Etched
- Fujitsu (Fugaku / MONAKA / Arm HPC)
- Google TPU
- Graphcore
- Groq
- HiSilicon (Huawei)
- Huawei Ascend (910B/910C)
- Huawei CANN
- Huawei CloudMatrix 384
- Hygon (Haiguang)
- Hyperscaler Custom-ASIC Shift
- Infineon Technologies
- Intel
- KV-cache & inference memory tiering
- Marvell Technology
- MediaTek
- Meta MTIA
- Microsoft Maia
- MLIR / OpenXLA / StableHLO
- Moore Threads
- NCCL (NVIDIA Collective Comms)
- NCCL / RCCL collectives
- Nvidia
- Nvidia Data-Center GPU (Blackwell/Rubin)
- Nvidia H20 (China-spec)
- Nvidia NeMo / NIM / Dynamo
- NVIDIA TensorRT-LLM / Dynamo
- Nvidia Vera Rubin platform
- NXP Semiconductors
- On-device / edge inference (NPUs, GGUF)
- ONNX
- PCIe / CXL
- Qualcomm (Edge AI / NPU)
- Renesas Electronics
- RISC-V (China adoption)
- SambaNova Systems
- SoftBank Compute / Izanagi & Arm AI
- STMicroelectronics
- T-Head (Alibaba PingTouGe)
- Tenstorrent
- Tesla Dojo
- Triton (OpenAI)
Foundries & packaging
- Advanced packaging capacity (US/Japan)
- Amkor Technology
- ASE Technology (ASE Group / SPIL)
- GlobalFoundries
- Intel Foundry
- JCET (advanced packaging)
- KYEC (King Yuan Electronics)
- Panel-level / glass-substrate packaging
- Powertech Technology (PTI)
- PSMC (Powerchip)
- Rapidus
- Samsung Foundry
- Shinko Electric Industries
- SMIC (Semiconductor Manufacturing International Corp)
- SMIC N+2 (7nm-class, DUV)
- Tongfu Microelectronics
- Toppan / DNP Photomasks
- TSMC (Taiwan Semiconductor Manufacturing Company)
- TSMC 3DFabric / InFO
- TSMC Advanced Packaging Fabs (AP7/Chiayi)
- TSMC Arizona (Fab 21)
- TSMC CoWoS (Chip-on-Wafer-on-Substrate)
- TSMC Fab 25 / Baoshan (N2 ramp)
- TSMC Japan (JASM Kumamoto)
- TSMC N2 (2nm, GAA)
- TSMC N3 (3nm)
- TSMC SoIC (System-on-Integrated-Chips)
- UMC (United Microelectronics Corporation)
- US Advanced-Packaging Gap
- Vanguard (VIS)
Equipment, EDA & memory
- Advantest
- Alchip / GUC (ASIC design services)
- AMEC (Advanced Micro-Fabrication)
- Applied Materials
- ASM International
- ASML High-NA EUV (EXE:5000/5200)
- ASML Holding
- BE Semiconductor (Besi)
- Cadence Design Systems
- Canon & Nikon Lithography
- Carl Zeiss SMT
- CXMT (ChangXin Memory)
- Cymer (ASML light source)
- DISCO Corporation
- DRAM
- Ebara Corporation
- Empyrean / domestic EDA
- EUV Lithography (13.5nm)
- EV Group
- HBM lithography bonding (hybrid bonding)
- HBM4
- High-Bandwidth Memory (HBM)
- imec
- Kioxia
- KLA Corporation
- Kokusai Electric
- Lam Research
- Lasertec
- Micron Technology
- NAND Flash
- NAURA Technology
- Samsung Electronics
- SCREEN Holdings
- Semiconductor skilled labor
- Siemens EDA (Mentor)
- SK Hynix
- SMEE (Shanghai Micro Electronics)
- SMEE / SiCarrier lithography effort
- Synopsys
- Teradyne
- Tokyo Electron (TEL)
- TRUMPF
- TSV / Die Stacking
- UCIe (chiplet interconnect)
- YMTC (Yangtze Memory)
Materials & minerals
- Advanced Packaging Substrates (ABF)
- AGC / Tosoh (EUV blanks & sputtering targets)
- Ajinomoto Build-up Film (ABF)
- AT&S
- China Ministry of Commerce (MOFCOM)
- Cobalt
- Copper
- Daikin (Fluoropolymers & Etch Gases)
- Dielectric coolant fluids (fluorochemicals)
- Epic / Clinical EHR Data
- Financial Market & Reference Data
- Fujimi Incorporated
- Gallium
- Germanium
- GlobalWafers
- HALEU Enrichment Fuel
- HOYA (EUV Mask Blanks)
- Ibiden
- JSR Corporation
- Lead-frame & bonding-wire supply (Chang Wah)
- Lithium
- Molybdenum & PFAS coolant fluids
- Nan Ya PCB
- Neon Gas
- Photoresist
- Rare Earth Elements
- Resonac (CMP slurry & packaging materials)
- Shin-Etsu Chemical
- Shinko Electric
- Silicon Wafers
- Siltronic
- SK Siltron
- Soitec
- Specialty & Electronic Gases
- SUMCO Corporation
- Tokyo Ohka Kogyo (TOK)
- Tungsten
- Ukraine Neon Supply
- Unimicron / ABF substrate makers
Energy, infrastructure & capital
- 'Eastern Data, Western Compute'
- Agriculture AI (AgTech)
- AI capex super-cycle (hyperscaler spend)
- AI electricity demand / grid strain
- AI Infrastructure Partnership
- AI Liability & Insurance
- AI liability & insurance market
- AI Safety Institutes (US CAISI / UK AISI)
- Alphabet (Google)
- Amazon
- Andreessen Horowitz (a16z)
- Arista Networks
- ASML–Mistral strategic stake
- Auras / AVC / Cooler cluster (Taiwan thermal)
- Bloom Energy
- Bosch (Robert Bosch GmbH)
- Broadcom
- CFIUS / outbound investment screening
- China (industrial policy & retaliation)
- China AI Chip Market / H20 & Domestic Substitution
- China REE / Gallium-Germanium Export Controls
- CHIPS and Science Act
- Cisco
- Co-packaged optics & silicon photonics
- Coherent
- Constellation Energy
- Coolant Distribution Units & cold plates
- Copyright & AI litigation
- CoreWeave (financing)
- CoreWeave Data Centers
- Datacenter debt & structured finance
- Defense & National Security AI
- Delta Electronics
- Digital Realty
- Electricity Grid & Utilities
- Energy & Utilities AI
- Equinix
- EU AI Act
- EU AI Act GPAI Code of Practice
- EU AI Continent Action Plan / InvestAI
- EU AI Factories & Gigafactories
- EU Chips Act
- EuroHPC Joint Undertaking
- European AI Office
- European sovereign AI (Mistral/Aleph Alpha)
- FDA SaMD / AI Device Clearance
- Financial Services AI
- Foxconn (Hon Hai)
- Foxconn / Hon Hai (AI servers)
- FTC/DOJ + EU AI antitrust scrutiny
- G42
- GE Vernova
- GPU gray market / diversion
- GPU-backed SPV / neocloud financing
- Grid Interconnection Queue
- Grid Transformers & Switchgear
- Healthcare & Life Sciences AI
- HIPAA / BAA Compliance Regime
- HUMAIN
- Immersion Cooling
- InfiniBand (NVIDIA Quantum)
- InnoLight (Eoptolink peer)
- Inventec
- ISO/IEC 42001 AI Management
- Japan (METI / Rapidus)
- JERA / Japan Grid & LNG Power
- JUPITER Exascale Supercomputer
- Kairos Power
- Legal AI
- Liquid Cooling
- Lite-On Technology
- Lumentum
- Manufacturing & Industrial AI
- MGX
- Microsoft
- MIIT (Ministry of Industry & IT)
- Mistral Compute / Essonne datacenter
- Murata Manufacturing
- National IC Fund (Big Fund III)
- Natural Gas Power
- Neocloud Debt Financing / GPU-backed Credit
- Netherlands (Dutch export controls)
- NIST AI Risk Management Framework
- NTT / IOWN (All-Photonics Network)
- Nuclear Power (incl. SMRs)
- NuScale Power
- Nvidia-OpenAI / circular vendor financing
- NVLink / NVSwitch
- Oklo
- On-site datacenter power generation
- OpenAI capital stack
- Private credit / AI infra debt
- Public Sector & Government AI
- QTS Data Centers
- Quanta Computer
- Retail & E-commerce AI
- Retimers & connectivity silicon (Astera, Credo)
- Saudi PIF
- Schneider Electric
- Sectoral Regulators (EU MDR, Basel, ITAR)
- Siemens Energy
- SoftBank Group
- Solar, Wind & Grid Storage
- Sony Semiconductor (CMOS Image Sensors)
- South Korea (K-Chips / HBM policy)
- Sovereign AI programs
- Spectrum-X / Ethernet-for-AI
- Stargate Project
- Sugon (Dawning)
- Supermicro / ODM system integrators
- Switch
- Systems Integrators & Consultancies
- Taiwan (geopolitical concentration risk)
- Taiwan Power & Water Constraint (Taipower)
- Taiwan Strait / geopolitical flashpoint
- TerraPower
- UALink Consortium
- Ultra Ethernet / UALink consortia
- US AI policy (2025 EO / AI Action Plan)
- US AI Safety Institute (CAISI/NIST)
- US AI Safety Institute / CAISI (NIST)
- US Export Controls (BIS)
- Vantage Data Centers
- Vendor-Circular Investment Loop
- Vertiv
- Vistra Corp
- Water & cooling resource constraints
- Water & thermal resource supply
- Wistron
- Wiwynn
- X-energy
- xAI (SpaceXAI)