Site map
AI Systems Map
Every entity in the AI value chain, one page each, by layer. 483 entries.
Also assitemap.xmlllms.txtllms-full.txtOKF site index
Start hereAI Systems MapThe AI Intelligence Graph
Frontier labs & models · 123
- AI21 Labs
- Alibaba Qwen (Tongyi)
- Amazon AGI (Nova)
- Anthropic
- Baidu ERNIE
- Claude (Opus / Sonnet)
- Cohere
- DeepSeek
- DeepSeek-V3 / R1
- Gemini
- Google DeepMind
- GPT-5 / o-series
- Grok
- Llama
- Meta (Meta AI / FAIR)
- Microsoft AI (MAI)
- Mistral AI
- Mistral Large
- Nvidia Research
- OpenAI
- Perplexity AI
- PyTorch
- Qwen
- Reka AI
- Safe Superintelligence (SSI)
- Tesla AI / xAI compute (Colossus)
- Thinking Machines Lab
- Training Data & Web Corpus
- Scale AI
- Surge AI
- Mercor
- Common Crawl
- NYT v. OpenAI/Microsoft (copyright)
- Reddit / content licensing deals
- Hugging Face
- LangChain / LangGraph
- Model Context Protocol (MCP)
- Cursor (Anysphere)
- GitHub Copilot
- Harvey AI
- OpenEvidence
- Abridge / ambient clinical AI
- JPMorgan (LLM Suite / financial AI)
- Bloomberg / financial-data AI
- Sierra (Bret Taylor)
- LMArena (Chatbot Arena)
- Epoch AI
- Agentic AI / autonomous workflows
- Reverse-acquihire / talent deals
- Anthropic capital stack (Amazon/Google)
- OpenAI PBC restructuring
- Humanoid / physical AI (Figure, Tesla Optimus)
- Waymo / autonomous driving
- Windsurf / GitHub Copilot / coding agents
- Midjourney / image-video gen
- ElevenLabs (voice AI)
- Frontier evals & benchmarks
- Synthetic data & distillation
- AI-native consumer hardware
- JAX / XLA
- SGLang
- JAX
- Licensed & proprietary data deals
- Agent interop protocols (A2A / AGNTCY)
- Agent frameworks (LangChain, LlamaIndex, etc.)
- Vector databases
- Evaluation & benchmark infrastructure
- AI security & guardrails
- MLOps / experiment & observability
- AI coding agents & IDEs
- Defense & government AI
- Robotics & physical AI (VLA models)
- Cognition (Devin)
- Glean
- Palantir AIP
- Surge AI / Mercor (expert data)
- AI Copyright Litigation (NYT et al.)
- SWE-bench / Evaluation Benchmarks
- Anduril / Defense AI
- Figure / Humanoid Robotics
- Apple Intelligence / On-Device AI
- ChatGPT (Consumer Distribution)
- AI Talent Market / Researcher Comp
- Agent Orchestration Frameworks
- AI Observability & Evaluation
- AI Safety, Guardrails & Red-Teaming
- Content & IP Licensing Deals
- Vertical & Agentic Benchmarks
- Moonshot AI (Kimi)
- Zhipu AI (Z.ai / GLM)
- MiniMax
- StepFun (Jieyue Xingchen)
- 01.AI (Yi)
- Tencent Hunyuan
- ByteDance Doubao / Seed
- iFlytek Spark
- Kimi K2
- GLM-4.6
- ERNIE 4.5 / X1
- Huawei MindSpore
- Baidu PaddlePaddle
- DeepSeek R2 / V3.x
- Preferred Networks (PFN)
- Sakana AI
- Aleph Alpha
- Black Forest Labs
- UK AI Safety Institute (AISI)
- Content Licensing & Copyright Regime
- Swiss AI Initiative (ETH/EPFL, Apertus)
- DeepSpeed / Megatron
- FlashAttention
- Transformer / MoE Architecture
- MLPerf (MLCommons)
- Frontier Evals (MMLU, GPQA, SWE-bench, ARC-AGI, HLE)
- Curated Pretraining Corpora (FineWeb, DCLM, The Stack, RedPajama)
- Surge AI / Mercor / Turing (frontier data labor)
- METR
- Frontier Safety Frameworks (RSP / Preparedness / FSF)
- Alignment Methods (RLHF, Constitutional AI, DPO)
- PyTorch Foundation (Linux Foundation)
- AI Safety & Interpretability Research (ARC, Redwood, Apollo)
- AI Coding Assistants (Cursor, Copilot, Windsurf, Claude Code)
- Enterprise & Vertical AI (Palantir, Glean, Harvey, Sierra, Abridge)
Cloud & compute · 32
- Amazon Web Services (AWS)
- Microsoft Azure
- Crusoe Energy
- Fireworks AI
- Google Cloud (GCP)
- Lambda (Lambda Labs)
- Meta (AI Infrastructure)
- Nebius Group
- Model-lab compute contracts
- Oracle Cloud Infrastructure (OCI)
- Scaleway
- Together AI
- Vultr
- Databricks
- Snowflake (Cortex)
- Palantir Technologies
- ServiceNow
- Salesforce Agentforce
- SAP (Joule / Business AI)
- vLLM
- Inference economics / token deflation
- Model routers & inference marketplaces
- vLLM / Inference Serving Stack
- OpenRouter / Model Gateways
- Inference Economics / Token Margins
- Enterprise Data Cloud (Snowflake/Databricks)
- Alibaba Cloud (Aliyun)
- Tencent Cloud
- ByteDance Volcano Engine
- Huawei Cloud
- Nscale
- llama.cpp / Ollama / GGUF (edge inference)
Accelerators & chips · 54
- AMD
- Ampere Computing
- Arm Holdings
- AWS Trainium / Inferentia
- Cerebras Systems
- d-Matrix
- Etched
- Google TPU
- Groq
- Intel
- Marvell Technology
- Meta MTIA
- Microsoft Maia
- Nvidia
- CUDA / software moat
- Nvidia Data-Center GPU (Blackwell/Rubin)
- SambaNova Systems
- Tenstorrent
- Tesla Dojo
- Nvidia Vera Rubin platform
- NCCL (NVIDIA Collective Comms)
- NVIDIA TensorRT-LLM / Dynamo
- MLIR / OpenXLA / StableHLO
- NCCL / RCCL collectives
- PCIe / CXL
- ONNX
- On-device / edge inference (NPUs, GGUF)
- KV-cache & inference memory tiering
- Qualcomm (Edge AI / NPU)
- Huawei Ascend (910B/910C)
- Huawei CANN
- Cambricon
- Biren Technology
- Moore Threads
- Enflame (Suiyuan)
- Hygon (Haiguang)
- Huawei CloudMatrix 384
- Nvidia H20 (China-spec)
- HiSilicon (Huawei)
- Baidu Kunlun (Kunlunxin)
- T-Head (Alibaba PingTouGe)
- RISC-V (China adoption)
- Fujitsu (Fugaku / MONAKA / Arm HPC)
- Renesas Electronics
- SoftBank Compute / Izanagi & Arm AI
- MediaTek
- Hyperscaler Custom-ASIC Shift
- Infineon Technologies
- STMicroelectronics
- NXP Semiconductors
- Arm Neoverse / CSS server IP
- Graphcore
- Triton (OpenAI)
- Nvidia NeMo / NIM / Dynamo
Foundries & packaging · 30
- Amkor Technology
- ASE Technology (ASE Group / SPIL)
- TSMC CoWoS (Chip-on-Wafer-on-Substrate)
- GlobalFoundries
- Intel Foundry
- Samsung Foundry
- SMIC (Semiconductor Manufacturing International Corp)
- TSMC SoIC (System-on-Integrated-Chips)
- TSMC (Taiwan Semiconductor Manufacturing Company)
- TSMC N2 (2nm, GAA)
- TSMC Arizona (Fab 21)
- UMC (United Microelectronics Corporation)
- Panel-level / glass-substrate packaging
- Advanced packaging capacity (US/Japan)
- Rapidus
- TSMC N3 (3nm)
- SMIC N+2 (7nm-class, DUV)
- JCET (advanced packaging)
- Shinko Electric Industries
- Toppan / DNP Photomasks
- KYEC (King Yuan Electronics)
- Powertech Technology (PTI)
- Tongfu Microelectronics
- PSMC (Powerchip)
- Vanguard (VIS)
- TSMC Advanced Packaging Fabs (AP7/Chiayi)
- TSMC Japan (JASM Kumamoto)
- TSMC Fab 25 / Baoshan (N2 ramp)
- TSMC 3DFabric / InFO
- US Advanced-Packaging Gap
Equipment, EDA & memory · 45
- Advantest
- Applied Materials
- ASML Holding
- Cadence Design Systems
- Canon & Nikon Lithography
- Cymer (ASML light source)
- DRAM
- EUV Lithography (13.5nm)
- High-Bandwidth Memory (HBM)
- HBM4
- Kioxia
- KLA Corporation
- Lam Research
- Micron Technology
- NAND Flash
- Samsung Electronics
- SCREEN Holdings
- Siemens EDA (Mentor)
- SK Hynix
- SMEE (Shanghai Micro Electronics)
- Synopsys
- Teradyne
- Tokyo Electron (TEL)
- TSV / Die Stacking
- Carl Zeiss SMT
- HBM lithography bonding (hybrid bonding)
- BE Semiconductor (Besi)
- EV Group
- imec
- Semiconductor skilled labor
- CXMT (ChangXin Memory)
- YMTC (Yangtze Memory)
- SMEE / SiCarrier lithography effort
- AMEC (Advanced Micro-Fabrication)
- NAURA Technology
- Empyrean / domestic EDA
- DISCO Corporation
- Lasertec
- Ebara Corporation
- Kokusai Electric
- UCIe (chiplet interconnect)
- Alchip / GUC (ASIC design services)
- ASML High-NA EUV (EXE:5000/5200)
- TRUMPF
- ASM International
Materials & minerals · 39
- Advanced Packaging Substrates (ABF)
- China Ministry of Commerce (MOFCOM)
- Cobalt
- Copper
- Gallium
- Germanium
- GlobalWafers
- HALEU Enrichment Fuel
- Ibiden
- JSR Corporation
- Neon Gas
- Photoresist
- Rare Earth Elements
- Shin-Etsu Chemical
- Silicon Wafers
- Siltronic
- SK Siltron
- Specialty & Electronic Gases
- SUMCO Corporation
- Tokyo Ohka Kogyo (TOK)
- Tungsten
- Ukraine Neon Supply
- Molybdenum & PFAS coolant fluids
- Unimicron / ABF substrate makers
- Ajinomoto Build-up Film (ABF)
- Lithium
- Dielectric coolant fluids (fluorochemicals)
- Epic / Clinical EHR Data
- Financial Market & Reference Data
- HOYA (EUV Mask Blanks)
- Resonac (CMP slurry & packaging materials)
- Fujimi Incorporated
- Daikin (Fluoropolymers & Etch Gases)
- AGC / Tosoh (EUV blanks & sputtering targets)
- Nan Ya PCB
- Shinko Electric
- AT&S
- Lead-frame & bonding-wire supply (Chang Wah)
- Soitec
Energy, infrastructure & capital · 132
- Andreessen Horowitz (a16z)
- Amazon
- Arista Networks
- AI Infrastructure Partnership
- Bloom Energy
- Broadcom
- China (industrial policy & retaliation)
- CHIPS and Science Act
- Cisco
- Coherent
- Constellation Energy
- CoreWeave (financing)
- CoreWeave Data Centers
- Digital Realty
- Equinix
- EU AI Act
- EU Chips Act
- Foxconn (Hon Hai)
- G42
- GE Vernova
- Alphabet (Google)
- HUMAIN
- Immersion Cooling
- InfiniBand (NVIDIA Quantum)
- InnoLight (Eoptolink peer)
- Japan (METI / Rapidus)
- Kairos Power
- Liquid Cooling
- Lumentum
- MGX
- Microsoft
- Natural Gas Power
- Netherlands (Dutch export controls)
- Nuclear Power (incl. SMRs)
- NuScale Power
- Spectrum-X / Ethernet-for-AI
- NVLink / NVSwitch
- Oklo
- OpenAI capital stack
- Electricity Grid & Utilities
- QTS Data Centers
- Solar, Wind & Grid Storage
- Saudi PIF
- South Korea (K-Chips / HBM policy)
- SoftBank Group
- Stargate Project
- Switch
- Taiwan (geopolitical concentration risk)
- Taiwan Strait / geopolitical flashpoint
- TerraPower
- Grid Transformers & Switchgear
- US Export Controls (BIS)
- Vantage Data Centers
- Vertiv
- Vistra Corp
- Water & thermal resource supply
- X-energy
- xAI (SpaceXAI)
- European sovereign AI (Mistral/Aleph Alpha)
- US AI Safety Institute (CAISI/NIST)
- US AI policy (2025 EO / AI Action Plan)
- CFIUS / outbound investment screening
- Private credit / AI infra debt
- GPU-backed SPV / neocloud financing
- Nvidia-OpenAI / circular vendor financing
- AI capex super-cycle (hyperscaler spend)
- AI electricity demand / grid strain
- FTC/DOJ + EU AI antitrust scrutiny
- AI liability & insurance market
- GPU gray market / diversion
- Ultra Ethernet / UALink consortia
- UALink Consortium
- Coolant Distribution Units & cold plates
- Supermicro / ODM system integrators
- On-site datacenter power generation
- Siemens Energy
- Water & cooling resource constraints
- AI Safety Institutes (US CAISI / UK AISI)
- Sovereign AI programs
- Datacenter debt & structured finance
- Copyright & AI litigation
- Retimers & connectivity silicon (Astera, Credo)
- Co-packaged optics & silicon photonics
- Neocloud Debt Financing / GPU-backed Credit
- Vendor-Circular Investment Loop
- Grid Interconnection Queue
- China AI Chip Market / H20 & Domestic Substitution
- Healthcare & Life Sciences AI
- Financial Services AI
- Defense & National Security AI
- Retail & E-commerce AI
- Manufacturing & Industrial AI
- Legal AI
- Energy & Utilities AI
- Agriculture AI (AgTech)
- Public Sector & Government AI
- Systems Integrators & Consultancies
- NIST AI Risk Management Framework
- ISO/IEC 42001 AI Management
- HIPAA / BAA Compliance Regime
- FDA SaMD / AI Device Clearance
- Sectoral Regulators (EU MDR, Basel, ITAR)
- AI Liability & Insurance
- National IC Fund (Big Fund III)
- MIIT (Ministry of Industry & IT)
- 'Eastern Data, Western Compute'
- China REE / Gallium-Germanium Export Controls
- Sugon (Dawning)
- Sony Semiconductor (CMOS Image Sensors)
- NTT / IOWN (All-Photonics Network)
- Murata Manufacturing
- JERA / Japan Grid & LNG Power
- Wiwynn
- Quanta Computer
- Wistron
- Foxconn / Hon Hai (AI servers)
- Inventec
- Delta Electronics
- Lite-On Technology
- Auras / AVC / Cooler cluster (Taiwan thermal)
- Taiwan Power & Water Constraint (Taipower)
- Bosch (Robert Bosch GmbH)
- EU AI Act GPAI Code of Practice
- European AI Office
- JUPITER Exascale Supercomputer
- EuroHPC Joint Undertaking
- EU AI Factories & Gigafactories
- Mistral Compute / Essonne datacenter
- ASML–Mistral strategic stake
- Schneider Electric
- EU AI Continent Action Plan / InvestAI
- US AI Safety Institute / CAISI (NIST)